M. LemitiN. Le QuangMonique GauthierDanièle Blanc-PélissierA. Focsa
A process for silicon solar cell fabrication associated with self–aligned Ni/Cu metallization is demonstrated with a reduced number of technological steps. After laser ablation of the anti-reflection coating, a nickel seed layer is formed by electroless chemical deposition followed by copper light-induced plating. Laboratory size solar cells were fabricated with different metal finger widths and spacings to evaluate the viability of the process. The best efficiency measured on 4 cm2 multi-crystalline solar cells was of the order of 16.5%. The limiting factors as well as possible improvements of the overall process are discussed.
Sang Hee LeeAtteq ur RehmanEun Gu ShinDoo Won LeeSoo Hong Lee
Mehul C. RavalChetan Singh Solanki
Y.T. GizachewLudovic EscoubasJonathan SimonM. PasquinelliJ. LoiretP.Y. LeguenJ.C. JimenoJ. MartinA. ApraizJ.P. Aguerre
Baomin XuKarl A. LittauJ. ZeschD. K. Fork