Design and Fabrication of Wafer-Level Package for RF MEMS Switch Using BCB

Renu Sharma; Isha Yadav; Anupriya Katiyar; Milap Singh; Shaveta Shaveta; Tulana Saha; Mohd Imran; Praveen Kumar; K. K. Jain; R. K. Bhan; P.S. Dutta

doi:10.1007/978-3-319-03002-9_118

BOOK-CHAPTER

Design and Fabrication of Wafer-Level Package for RF MEMS Switch Using BCB

Renu Sharma Isha Yadav Anupriya Katiyar Milap Singh Shaveta Shaveta Tulana Saha Mohd Imran Praveen Kumar K. K. Jain R. K. Bhan P.S. Dutta

Year: 2013 Environmental science and engineering Pages: 473-474 Publisher: Springer Nature

DOI: 10.1007/978-3-319-03002-9_118

Get Full-Text PDF Get Analytical Report

Keywords:

Wafer Wafer dicing Microelectromechanical systems Fabrication Materials science Wafer-level packaging Optoelectronics Wafer testing Die preparation Electronic engineering Engineering

Metrics

Cited By

0.00

FWCI (Field Weighted Citation Impact)

Refs

0.27

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Topics

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Semiconductor Lasers and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Design and Fabrication of Wafer-Level Package for RF MEMS Switch Using BCB

Metrics

Topics

Related Documents

Design, Fabrication and Testing of Wafer Level Vacuum Package for MEMS Device

RF MEMS Switch with Wafer Level Package Utilizing Frit Glass Bonding

RF MEMS Switch with Wafer Level Package Utilizing Frit Glass Bonding

Fabrication and Testing of a Wafer-Level Vacuum Package for MEMS Device

Millimeter-wave MEMS capacitive switch in vacuum-sealed in-line wafer level package