BOOK-CHAPTER

Design and Fabrication of Wafer-Level Package for RF MEMS Switch Using BCB

Keywords:
Wafer Wafer dicing Microelectromechanical systems Fabrication Materials science Wafer-level packaging Optoelectronics Wafer testing Die preparation Electronic engineering Engineering

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Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced MEMS and NEMS Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Semiconductor Lasers and Optical Devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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