JOURNAL ARTICLE
Fine Feature Solder Paste Printing For Solder Sphere and Solder Trace Manufacturing
Nicole DallmanKaycie GerstnerKristi JeanFred HaringSyed Sajid AhmadAaron Reinholz
Year: 2010 Journal: IMAPSource Proceedings Vol: 2010 (1)Pages: 000813-000820 Publisher: International Microelectronics Assembly and Packaging Society
Abstract
Fine round and oblong features were printed using fine solder paste. Diameters and spacings were measured and data was analyzed to show solder feature printing capabilities. The printed features varied from 50 to 450 micron diameters with 50 to 150 micron spacings. Analysis of the solder features showed that printing of round features was possible at every size and spacing, with minimal bridging of the very small spaced features after reflow.
Keywords:
Soldering Solder paste Materials science Bridging (networking) Printed circuit board Feature (linguistics) Metallurgy Composite material Computer science
Metrics
1
Cited By
0.00
FWCI (Field Weighted Citation Impact)
2
Refs
0.20
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Additive Manufacturing and 3D Printing Technologies
Physical Sciences → Engineering → Automotive Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Related Documents
JOURNAL ARTICLE
Solder Paste for Fine Printing.
Journal: Journal of SHM Year: 1996 Vol: 12 (1)Pages: 36-39
JOURNAL ARTICLE
Fine feature solder paste printing for SiP applications
Sze-Pei LimKenneth ThumAndy Mackie
Year: 2017 Pages: 1-5
JOURNAL ARTICLE
Challenges in Fine Feature Solder Paste Printing for SiP Applications
Sze Pei-LimKenneth ThumAndy Mackie
Journal: IMAPSource Proceedings Year: 2016 Vol: 2016 (1)Pages: 000245-000249