BOOK-CHAPTER
Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints
Year: 2015 Springer theses Pages: 91-118 Publisher: Springer Nature
Keywords:
Materials science Soldering Creep Metallurgy Grain Boundary Sliding Grain boundary Joint (building) Strain hardening exponent Composite material Deformation (meteorology) Structural engineering Microstructure
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Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Aluminum Alloys Composites Properties
Physical Sciences → Engineering → Mechanical Engineering
Advanced Welding Techniques Analysis
Physical Sciences → Engineering → Mechanical Engineering
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