Three-dimensional discharge simulation of inductively coupled plasma (ICP) etching reactor

Yiran An; Yijia Lu; DongSan Li; Yaosong Chen

doi:10.1007/s11431-008-0065-1

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Three-dimensional discharge simulation of inductively coupled plasma (ICP) etching reactor

Yiran An Yijia Lu DongSan Li Yaosong Chen

Year: 2008 Journal: Science in China. Series E, Technological sciences/Science in China. Series E, Technological Sciences Vol: 51 (6)Pages: 674-682

DOI: 10.1007/s11431-008-0065-1

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Keywords:

Inductively coupled plasma Microelectronics Plasma Etching (microfabrication) Materials science Electron density Plasma etching Electron temperature Deposition (geology) Analytical Chemistry (journal) Inductively coupled plasma atomic emission spectroscopy Electromagnetic coil Nuclear engineering Chemistry Optoelectronics Electrical engineering Engineering Composite material Physics Nuclear physics Geology

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Plasma Diagnostics and Applications

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Electrohydrodynamics and Fluid Dynamics

Physical Sciences → Engineering → Electrical and Electronic Engineering

Three-dimensional discharge simulation of inductively coupled plasma (ICP) etching reactor

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