Prototype ATLAS IBL modules using the FE-I4A front-end readout chip

Abstract

The ATLAS Collaboration will upgrade its semiconductor pixel tracking\ndetector with a new Insertable B-layer (IBL) between the existing pixel\ndetector and the vacuum pipe of the Large Hadron Collider. The extreme\noperating conditions at this location have necessitated the development of new\nradiation hard pixel sensor technologies and a new front-end readout chip,\ncalled the FE-I4. Planar pixel sensors and 3D pixel sensors have been\ninvestigated to equip this new pixel layer, and prototype modules using the\nFE-I4A have been fabricated and characterized using 120 GeV pions at the CERN\nSPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test\nresults are presented, including charge collection efficiency, tracking\nefficiency and charge sharing.\n