Joseph F. AhadianSteven G. PattersonP.T. VaidyanathanY. RoyterD.E. MullG.S. PetrichWilliam GoodhueSheila PrasadL. A. KolodziejskiClifton G. Fonstad
Optical interconnects for use in high speed computing and communication systems require dense optoelectronic integrated circuits (OEICs). Monolithic integration of III-V optoelectronics with VLSI optoelectronics with VLSI- complexity electronics will yield OEICs of the high density, performance, manufacturability, and reliability. The epitaxy-on-electronics (EoE) technique monolithically integrates optoelectronic devices with commercially- fabricated, fully-metallized GaAs VLSI integrated circuits. This manuscript reviews the EoE process and details the fabrication of integrated LEDs. This LED-OEIC process is being used by optical interconnect systems researchers on a prototype basis through the OPTOCHIP project: the current status of this effort is reviewed.
Horst ZimmermannHorst Dietrich
Jon S. McElvainJohn LanganRussel BehmMichael CostoloAlan J. Heeger
Richard D. AshP.M. CharlesGareth J. F. JonesPeter J. WilliamsA.K. Wood