Enhanced thermal conductivity in diamond/aluminum composites with a tungsten interface nanolayer

Zhanqiu Tan; Zhiqiang Li; Genlian Fan; Qiang Guo; Xizhou Kai; Gang Ji; Lanting Zhang; Di Zhang

doi:10.1016/j.matdes.2012.11.061

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Enhanced thermal conductivity in diamond/aluminum composites with a tungsten interface nanolayer

Zhanqiu Tan Zhiqiang Li Genlian Fan Qiang Guo Xizhou Kai Gang Ji Lanting Zhang Di Zhang

Year: 2012 Journal: Materials & Design (1980-2015) Vol: 47 Pages: 160-166 Publisher: Elsevier BV

DOI: 10.1016/j.matdes.2012.11.061

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Keywords:

Materials science Diamond Thermal conductivity Composite material Interfacial thermal resistance Microstructure Composite number Tungsten Aluminium Thermal Hot pressing Thermal resistance Metallurgy

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Thermal properties of materials

Physical Sciences → Materials Science → Materials Chemistry

Diamond and Carbon-based Materials Research

Physical Sciences → Materials Science → Materials Chemistry

Tribology and Wear Analysis

Physical Sciences → Engineering → Mechanics of Materials

Enhanced thermal conductivity in diamond/aluminum composites with a tungsten interface nanolayer

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