Temperature field of thick thermoset composite laminates during cure process

Zhansheng Guo; Shuaishuai Du; Boming Zhang

doi:10.1016/j.compscitech.2004.07.015

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JOURNAL ARTICLE

Temperature field of thick thermoset composite laminates during cure process

Zhansheng Guo Shuaishuai Du Boming Zhang

Year: 2004 Journal: Composites Science and Technology Vol: 65 (3-4)Pages: 517-523 Publisher: Elsevier BV

DOI: 10.1016/j.compscitech.2004.07.015

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Keywords:

Thermosetting polymer Materials science Composite material Finite element method Exothermic reaction Composite laminates Composite number Heat transfer Transfer molding Structural engineering Mechanics

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Epoxy Resin Curing Processes

Physical Sciences → Engineering → Mechanical Engineering

Mechanical Behavior of Composites

Physical Sciences → Engineering → Mechanics of Materials

Injection Molding Process and Properties

Physical Sciences → Engineering → Mechanical Engineering

Temperature field of thick thermoset composite laminates during cure process

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