Abstract

A method that allows simplified linear FEAs (finite-element analyses) to be used instead of the more complex elastic-plastic nonlinear FEA is outlined. Guidelines for mesh generation that will eliminate arithmetic errors caused when materials with large stiffness differences are adjacent to each other are established. The accuracy of FEAs when dealing with very small dimensions was verified. Procedures for combining various loadings in order to predict life are established for materials which exhibit stress relaxation and for those which do not. With these guidelines, FEAs can be used to predict the structural life of electronic equipment.< >

Keywords:
Finite element method Reliability (semiconductor) Stiffness Computer science Nonlinear system Relaxation (psychology) Stress (linguistics) Structural engineering Mechanical engineering Algorithm Engineering Physics

Metrics

2
Cited By
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FWCI (Field Weighted Citation Impact)
8
Refs
0.20
Citation Normalized Percentile
Is in top 1%
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Citation History

Topics

Silicon Carbide Semiconductor Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Probabilistic and Robust Engineering Design
Social Sciences →  Decision Sciences →  Statistics, Probability and Uncertainty
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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