Degradation of Copper-Silver Alloy Thin Films Induced by Annealing

Stephen Snyder; Alexander H. King

doi:10.1557/proc-0887-q09-02

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Degradation of Copper-Silver Alloy Thin Films Induced by Annealing

Stephen Snyder Alexander H. King

Year: 2005 Journal: MRS Proceedings Vol: 887 Publisher: Cambridge University Press

DOI: 10.1557/proc-0887-q09-02

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Keywords:

Materials science Copper Annealing (glass) Alloy Crystallite Thin film Void (composites) Metallurgy Eutectic system Diffusion barrier Metastability Composite material Nanotechnology Layer (electronics)

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Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Degradation of Copper-Silver Alloy Thin Films Induced by Annealing

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