Advanced lithography for high aspect ratio MEMS technology

Abstract

MEMS (microelectromechanical systems) devices require thick and high aspect ratio film processing for their novel microstructures. The development of high-aspect-ratio processing, in which the vertical dimensions can be large compared to the lateral dimensions, has made it possible to move from planar to three-dimensional micromechanical structures. High aspect ratio microstructures can The fabricated by deep X-ray lithography, energy beams and physical cutting tools, and replication in metals, plastics, and ceramics. is paper investigated fabrication methods for high aspect ratio microstructures.