High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride

A. A. Postnikov; V.G. Verjovka

doi:10.4028/www.scientific.net/kem.89-91.633

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JOURNAL ARTICLE

High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride

A. A. Postnikov V.G. Verjovka

Year: 1993 Journal: Key engineering materials Vol: 89-91 Pages: 633-634 Publisher: Trans Tech Publications

DOI: 10.4028/www.scientific.net/kem.89-91.633

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Keywords:

Creep Materials science Silicon nitride Composite material Deformation (meteorology) Diffusion creep Nitride Metallurgy Silicon Grain boundary Microstructure Layer (electronics)

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Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Boron and Carbon Nanomaterials Research

Physical Sciences → Materials Science → Materials Chemistry

High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride

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