JOURNAL ARTICLE

Molecular dynamics simulation of interfacial thermal conductance between silicon and amorphous polyethylene

Ming HuSergei ShenoginPawel Keblinski

Year: 2007 Journal:   Applied Physics Letters Vol: 91 (24)   Publisher: American Institute of Physics

Abstract

Using nonequilibrium molecular dynamics simulations, we study the interfacial thermal conductance between single crystal silicon and amorphous polyethylene (PE). We estimate that the silicon-PE interfacial thermal conductance is about 20MW∕m2K at room temperature, which is equivalent to the resistance of 16nm thick layer of bulk amorphous polyethylene. We also study the role of solid stiffness and the bonding strength across the interface on the interfacial thermal resistance. With strong interfacial bonding, our results are in agreement with the diffuse mismatch model and phonon radiation limit predictions, suggesting that in this case, heat carrying acoustic phonons in solids have transmission coefficients to polymer equal almost to unity.

Keywords:
Materials science Amorphous solid Silicon Polyethylene Phonon Molecular dynamics Interfacial thermal resistance Thermal conductivity Amorphous silicon Thermal Composite material Condensed matter physics Thermal resistance Chemical physics Thermodynamics Crystalline silicon Crystallography Chemistry Computational chemistry Physics Metallurgy

Metrics

73
Cited By
1.61
FWCI (Field Weighted Citation Impact)
15
Refs
0.84
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Thermal properties of materials
Physical Sciences →  Materials Science →  Materials Chemistry
Polymer Nanocomposite Synthesis and Irradiation
Physical Sciences →  Materials Science →  Polymers and Plastics
Carbon Nanotubes in Composites
Physical Sciences →  Materials Science →  Materials Chemistry
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