Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal

Abstract

Abstract. The reaction layer microstructure of SiC/SiC joints brazed by Ag-Cu-Ti filler metal, including composition, morphology, grain size were investigated by X-ray diffraction, electronic probe microanalysis, transmission electron microscope. An obvious reaction layer composed of TiC and Ti5Si3 was observed at the interface of SiC substrate and filler metal. There is a representative structure of SiC substrate/continuous fine TiC layer /discontinuous coarse Ti5Si3 layer/filler metal in the reaction layer. The continuous TiC layer, composed of about 10 nm roundish grains, is 350 ~ 400 nm thick. Ti5Si3 layer is composed of only one row of Ti5Si3 grains, which disperse with diverse size from 100 ~ 500 nm. Different growth behavior of TiC and Ti5Si3 is the main reason to form this microstructure.