Comments on the IPC Surface Mount Attachment Reliability Guidelines

Abstract

The Institute for Interconnecting and Packaging Electronic Circuits (IPC) has published guidelines and standards related to surface mount solder attachments. The latest standard IPC-9701 was published in 2002. In this paper, the general methodology for creating the aforementioned documents and the related qualification requirements are reviewed and discussed. Also, corrections to the standards and guidelines are proposed. The corrections are related both to the use of formulas and to inaccuracies in the units used. Copyright © 2005 John Wiley & Sons, Ltd.