Laser-induced surface modification on LTCC materials for chemical metallization

Abstract

Low temperature co-fired ceramics (LTCCs) are mainly applied in hybride microelectronics packaging technology, whereas the fabrication of metallic conductors on LTCC materials is done by various printing technologies. The conventional process is fast and cost-effective in the case of mass-production but too slow and difficult when repair and/or some modifications in circuitry are needed. Printing also fails when deposition of thin metal films on LTCC is demanded. Here, a simple laser-assisted process is presented by which the surface of LTCCs can be activated for consecutive electroless chemical metal plating. The method enables the realization of thick high-conductance metallic Cu micro-patterns and thin seed layers of Ag and Au, with a lateral resolution of a few tens of micrometers. The process is also suitable for 3D-MEMS applications. Morphological, structural and composition aspects of LTCC surfaces treated by a Nd:YAG pulses are carried out using FESEM, SEM, XRD and Raman measurements.