JOURNAL ARTICLE

Fabrication of W@Cu composite powders by direct electroless plating using a dripping method

Shulong LiuYu‐He KanQiang ShenMeijuan LiWenshu ChenGuoqiang LuoLianmeng Zhang

Year: 2013 Journal:   Journal of Wuhan University of Technology-Mater Sci Ed Vol: 28 (4)Pages: 829-833   Publisher: Springer Science+Business Media
Keywords:
Composite number Materials science Copper plating Plating (geology) Copper Coating Electroless plating Metallurgy Chemical engineering Composite material Layer (electronics) Electroplating

Metrics

7
Cited By
1.59
FWCI (Field Weighted Citation Impact)
24
Refs
0.84
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Advanced materials and composites
Physical Sciences →  Engineering →  Mechanical Engineering
Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
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