Fabrication of W@Cu composite powders by direct electroless plating using a dripping method

Shulong Liu; Yu‐He Kan; Qiang Shen; Meijuan Li; Wenshu Chen; Guoqiang Luo; Lianmeng Zhang

doi:10.1007/s11595-013-0777-3

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Fabrication of W@Cu composite powders by direct electroless plating using a dripping method

Shulong Liu Yu‐He Kan Qiang Shen Meijuan Li Wenshu Chen Guoqiang Luo Lianmeng Zhang

Year: 2013 Journal: Journal of Wuhan University of Technology-Mater Sci Ed Vol: 28 (4)Pages: 829-833 Publisher: Springer Science+Business Media

DOI: 10.1007/s11595-013-0777-3

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Keywords:

Composite number Materials science Copper plating Plating (geology) Copper Coating Electroless plating Metallurgy Chemical engineering Composite material Layer (electronics) Electroplating

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Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Fabrication of W@Cu composite powders by direct electroless plating using a dripping method

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