JOURNAL ARTICLE

Vacuum deposited Co-Cr films with perpendicular magnetic anisotropy

R. SugitaF. Kobayashi

Year: 1982 Journal:   IEEE Transactions on Magnetics Vol: 18 (6)Pages: 1818-1822   Publisher: IEEE Magnetics Society

Abstract

Magnetic and structural properties of vacuum deposited cobalt-chromium (Co-Cr) films with perpendicular magnetic anisotropy have been studied. The films were deposited on tape-shaped heat-resistant polymer substrates which were continuously transported around a cylindrical can in evaporation vacuum chamber. During deposition the can was heated at elevated substrate temperatures. The deposition rate was in the range of several thousand angstroms per second, and the substrate transport speed was about 10 m/min. The perpendicular coercive force and the perpendicular anisotropy magnetic field of the films increased as the substrate temperatures were elevated. A perpendicular coercive force greater than 1000 Oe was obtained for the substrate temperatures higher than 300°C. All the Co-Cr films deposited at substrate temperatures 30-350°C had hexagonal close-packed (hcp) crystal structures and nearly constant values of c-axis orientation Δθ 50 .

Keywords:
Materials science Coercivity Substrate (aquarium) Perpendicular Magnetic anisotropy Vacuum evaporation Vacuum deposition Deposition (geology) Anisotropy Evaporation Condensed matter physics Thin film Nuclear magnetic resonance Cobalt Magnetic field Composite material Analytical Chemistry (journal) Magnetization Nanotechnology Metallurgy Optics Chemistry Physics Geometry

Metrics

21
Cited By
0.94
FWCI (Field Weighted Citation Impact)
9
Refs
0.72
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Magnetic properties of thin films
Physical Sciences →  Physics and Astronomy →  Atomic and Molecular Physics, and Optics
Diamond and Carbon-based Materials Research
Physical Sciences →  Materials Science →  Materials Chemistry
Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials

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