J. DienerN. KünznerE. F. GrossD. KovalevMinoru Fujii
Abstract Anisotropic nanostructuring of bulk silicon (Si) wafers leads to a significant in‐plane optical anisotropy of single porous silicon (PSi) layers. Additionally a variation of the etching current in time allows a controlled modification of the porosity along the growth direction and therefore a three‐dimensional variation of the refractive index (in‐plane and in‐depth). This technique can be important for photonic applications since it is the basis of a development of a variety of novel, polarization‐sensitive, silicon‐based optical devices: retarders, dichroic Bragg reflectors, dichroic microcavities and planar Si‐based polarizers. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
J. DienerN. KünznerE. F. GrossD. KovalevMinoru Fujii
П. К. КашкаровL. A. GolovanA. B. FedotovA. I. EfimovaL.P. KuznetsovaV. Yu. TimoshenkoDmitrii A. Sidorov-BiryukovА. М. ЖелтиковJoseph W. Haus
D. KovalevG. PolisskiJ. DienerH. HecklerN. K�nznerF. Koch
Ilaria ReaLuigi MorettiLucia RotirotiIvo RendinaLuca De Stefano