JOURNAL ARTICLE

Thermoelectric properties of Sn-filled skutterudites

George S. NolasHirotsugu TakizawaTomoyuki EndoHeike SellinscheggDavid C. Johnson

Year: 2000 Journal:   Applied Physics Letters Vol: 77 (1)Pages: 52-54   Publisher: American Institute of Physics

Abstract

Thermal conductivity, resistivity, Seebeck coefficient, and structure measurements of CoSb3 with tin interstitially placed in the voids are reported. These tin-filled skutterudites were synthesized under high pressure and temperature conditions; they cannot be synthesized under “normal” synthesis approaches. The tin atoms exhibit very large atomic displacement parameters indicating a large “rattling” motion inside their atomic “cages.” The disorder induced by the Sn atoms is a very good phonon scattering mechanism. The thermal conductivity of these compounds is very low with a temperature dependence that is atypical of simple solids. The tin-filled compounds exhibit n-type semiconducting behavior with relatively high Seebeck coefficients for compounds whose electronic properties have not been optimized. The potential for thermoelectric applications is discussed.

Keywords:
Thermoelectric effect Tin Seebeck coefficient Electrical resistivity and conductivity Materials science Thermoelectric materials Thermal conductivity Phonon Phonon scattering Scattering Condensed matter physics Thermodynamics Composite material Metallurgy Optics

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0.92
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Citation History

Topics

Advanced Thermoelectric Materials and Devices
Physical Sciences →  Materials Science →  Materials Chemistry
Advanced Semiconductor Detectors and Materials
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Thermodynamic and Structural Properties of Metals and Alloys
Physical Sciences →  Engineering →  Mechanical Engineering
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