Reference-free crack detection using transfer impedances

Seunghee Park; Changgil Lee; Hoon Sohn

doi:10.1016/j.jsv.2009.04.010

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Reference-free crack detection using transfer impedances

Seunghee Park Changgil Lee Hoon Sohn

Year: 2009 Journal: Journal of Sound and Vibration Vol: 329 (12)Pages: 2337-2348 Publisher: Elsevier BV

DOI: 10.1016/j.jsv.2009.04.010

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Keywords:

Electrical impedance Acoustics Transfer (computing) Mode (computer interface) Computer science Structural engineering Electronic engineering Engineering Electrical engineering Physics

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Ultrasonics and Acoustic Wave Propagation

Physical Sciences → Engineering → Mechanics of Materials

Structural Health Monitoring Techniques

Physical Sciences → Engineering → Civil and Structural Engineering

Non-Destructive Testing Techniques

Physical Sciences → Engineering → Mechanical Engineering

Reference-free crack detection using transfer impedances

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