Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition

Abstract

Cu/multiwalled carbon nanotube (MWCNT) composite plating by a pulse-reverse (PR) electrodeposition method was investigated in order to increase the MWCNT content of the composite plating films. The electrodeposition and dissolution behaviors of the composite films were investigated using scanning electron microscopy and X-ray diffraction to determine the most suitable electrodeposition and dissolution current densities for PR electrodeposition. PR electrodeposition of the Cu/MWCNT composite films was conducted by varying the current reverse ratios at the most suitable electrodeposition and dissolution current densities. The surface morphology of the Cu/MWCNT composite films after dissolution was significantly changed by variation of the anodic current densities. The MWCNT content of the composite films formed by PR electrodeposition was greater than that obtained using a direct current (dc) electrodeposition method, and reached a maximum value of , which is a 40% increase over that for dc electrodeposition. Furthermore, the surface roughness of the composite films fabricated by PR electrodeposition was less than that by dc electrodeposition.