JOURNAL ARTICLE
A new approach to aspect ratio independent etching
Year: 1998 Journal: Microelectronic Engineering Vol: 41-42 Pages: 423-426 Publisher: Elsevier BV
Keywords:
Aspect ratio (aeronautics) Etching (microfabrication) Reactive-ion etching Scaling Silicon Materials science Dry etching Flux (metallurgy) Plasma etching Analytical Chemistry (journal) Nanotechnology Chemistry Optoelectronics Layer (electronics) Metallurgy Geometry Mathematics
Metrics
6
Cited By
0.44
FWCI (Field Weighted Citation Impact)
4
Refs
0.68
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Plasma Diagnostics and Applications
Physical Sciences → Engineering → Electrical and Electronic Engineering
Semiconductor materials and devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advancements in Semiconductor Devices and Circuit Design
Physical Sciences → Engineering → Electrical and Electronic Engineering
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