Preparation of ultra fine copper–nickel bimetallic powders for conductive thick film

Songping Wu; Jiao Li; Ni Jing; Zeng Zhen-ou; Song Liu

doi:10.1016/j.intermet.2007.04.001

ScienceGate Book Chapters

JOURNAL ARTICLE

Preparation of ultra fine copper–nickel bimetallic powders for conductive thick film

Songping Wu Jiao Li Ni Jing Zeng Zhen-ou Song Liu

Year: 2007 Journal: Intermetallics Vol: 15 (10)Pages: 1316-1321 Publisher: Elsevier BV

DOI: 10.1016/j.intermet.2007.04.001

Get Full-Text PDF Get Analytical Report

Keywords:

Bimetallic strip Materials science Nickel Copper Particle size Flake Particle (ecology) Composite material Electrical resistivity and conductivity Electrical conductor Chemical engineering Metallurgy Metal

Metrics

Cited By

5.19

FWCI (Field Weighted Citation Impact)

Refs

0.95

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Electrical and Thermal Properties of Materials

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electrical Contact Performance and Analysis

Physical Sciences → Engineering → Mechanical Engineering

Preparation of ultra fine copper–nickel bimetallic powders for conductive thick film

Metrics

Citation History

Topics

Related Documents

Preparation of ultra-fine copper–nickel bimetallic powders with hydrothermal–reduction method

Preparation of ultra-fine copper powder and its lead-free conductive thick film

Preparation of ultra fine nickel–copper bimetallic powder for BME-MLCC

Preparation and Performance of Thick Copper Electronic Conductive Film from Copper Powders with Dual Particle Shapes

Preparation of ultra-fine molybdenum‒copper composite powders and fine-grained molybdenum‒copper alloys