JOURNAL ARTICLE
Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)
Abstract
This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated
Keywords:
Ball grid array Heat sink Flip chip Materials science Ball (mathematics) Soldering Temperature cycling Grid Compressive strength Structural engineering Thermal Mechanical engineering Composite material Engineering Geology
Metrics
5
Cited By
0.00
FWCI (Field Weighted Citation Impact)
6
Refs
0.15
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Silicon Carbide Semiconductor Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Related Documents
JOURNAL ARTICLE
Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array
Keh Shin BehWei Keat LohJenn Seong LeongWooi Aun Tan
Year: 2005 Pages: 1449-1454
JOURNAL ARTICLE
Characterization of on-die power supply noise in FCBGA (Flip-chip ball grid array) packages
Year: 2014 Pages: 554-559
JOURNAL ARTICLE
Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors
Gaurav SharmaNishant LakheraSandeep ShantaramWilly Huang
Journal: IMAPSource Proceedings Year: 2023 Vol: 2022 (IMAPS Symposium)