As the number of materials and devices used in micro-engineering continues to expand, so does the number of viable manufacturing techniques. One of the more recent techniques used to fabricate devices from electrically-conductive materials is micro-electrodischarge machining (μ-EDM). Micro-EDM is a generic term that encompasses at least four different EDM processes, some of which are used synergistically to create novel products that cannot be made economically by other processes. The four μ-EDM processes are: wire electrodischarge grinding (WEDG), μ-EDM by die-sinking, μ-wire electrodischarge machining (μ-WEDM) and μ-electrodischarge grinding (μ-EDG). Each of these processes has unique attributes that allow certain types of components to be fabricated with relative ease. (2 pages)
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