JOURNAL ARTICLE

Dynamical growth behavior of copper clusters during electrodeposition

Abstract

Ultrahigh resolution full-field transmission x-ray microscopy enabled us to observe detailed phenomena during the potentiostatic copper electrodeposition on polycrystalline gold. We detected two coexisting cluster populations with different sizes. Their growth behaviors are different, with a shape transitions only occurring for large clusters. These differences influence the micromorphology and general properties of the overlayer.

Keywords:
Overlayer Copper Cluster (spacecraft) Crystallite Materials science Chemical physics Cluster size Transmission electron microscopy Condensed matter physics Nanotechnology Metallurgy Chemistry Electronic structure Physics

Metrics

15
Cited By
2.32
FWCI (Field Weighted Citation Impact)
26
Refs
0.90
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Force Microscopy Techniques and Applications
Physical Sciences →  Physics and Astronomy →  Atomic and Molecular Physics, and Optics
Corrosion Behavior and Inhibition
Physical Sciences →  Materials Science →  Materials Chemistry

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