Thermal expansion instability and creep in amine‐cured epoxy resins

Abstract

Abstract Similar thermal expansion instabilities, consisting of isothermal, time‐dependent changes in thermal expansion after a rapid change in temperature, were observed in epoxy resins with different degrees of cross‐linking. Creep experiments performed at different stages of expansion show decreases in tensile creep rate with decreased expansion. The role of changes in moisture content as a possible cause of the dimensional instability is examined for epoxy resins and a highly cross‐linked polyurethane. Results indicate that the state of expansion is the primary cause of changes in creep rate rather than temperature or moisture content.