Diffusion bonding of commercially pure Ni using Cu interlayer

JOURNAL ARTICLE

Year: 2012 Journal: Materials Characterization Vol: 69 Pages: 90-96 Publisher: Elsevier BV

DOI: 10.1016/j.matchar.2012.04.010

Keywords:

Materials science Diffusion Diffusion bonding Copper Crystallography Metallurgy Chemical engineering Thermodynamics

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