JOURNAL ARTICLE

Diffusion bonding of commercially pure Ni using Cu interlayer

Ashfaqur RahmanMatthew Cavalli

Year: 2012 Journal:   Materials Characterization Vol: 69 Pages: 90-96   Publisher: Elsevier BV
Keywords:
Materials science Diffusion Diffusion bonding Copper Crystallography Metallurgy Chemical engineering Thermodynamics

Metrics

17
Cited By
1.76
FWCI (Field Weighted Citation Impact)
27
Refs
0.85
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

High Temperature Alloys and Creep
Physical Sciences →  Engineering →  Mechanical Engineering
Intermetallics and Advanced Alloy Properties
Physical Sciences →  Engineering →  Mechanical Engineering
Microstructure and mechanical properties
Physical Sciences →  Materials Science →  Materials Chemistry

Related Documents

JOURNAL ARTICLE

Diffusion Bonding of Commercially Pure Titanium to Q235B Using Copper as Interlayer

Jia Geng LiuJing HanJing LiuShuai Ji

Journal:   Advanced materials research Year: 2014 Vol: 941-944 Pages: 81-88
JOURNAL ARTICLE

Diffusion bonding of commercially pure titanium to low carbon steel using a silver interlayer

Evren AtasoyNizamettin Kahraman

Journal:   Materials Characterization Year: 2008 Vol: 59 (10)Pages: 1481-1490
© 2026 ScienceGate Book Chapters — All rights reserved.