&lt;title&gt;Wavelength division multiplexing using 3D interconnection structures&lt;/title&gt;

D. Reinker

doi:10.1117/12.238907

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<title>Wavelength division multiplexing using 3D interconnection structures</title>

D. Reinker

Year: 1996 Journal: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Vol: 2690 Pages: 126-135 Publisher: SPIE

DOI: 10.1117/12.238907

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Abstract

Semiconductor edge emitting lasers are passively aligned to polymeric waveguides on high thermal conductivity substrates. The single mode waveguides are combined to provide a high bandwidth wavelength division multiplexed channel. 3D stacks of the substrates are interconnected electrically and optically for further multiplexing.

Keywords:

Wavelength-division multiplexing Optoelectronics Multiplexing Interconnection Wavelength Materials science Bandwidth (computing) Semiconductor Division (mathematics) Enhanced Data Rates for GSM Evolution Laser Optics Telecommunications Physics Computer science

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Semiconductor Lasers and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Photonic and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Photonic Crystals and Applications

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

<title>Wavelength division multiplexing using 3D interconnection structures</title>

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