Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature

Hui‐Wang Cui; Dong‐Sheng Li; Qiong Fan

doi:10.1007/s11664-012-2105-7

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Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature

Hui‐Wang Cui Dong‐Sheng Li Qiong Fan

Year: 2012 Journal: Journal of Electronic Materials Vol: 41 (9)Pages: 2599-2605 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-012-2105-7

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Keywords:

Materials science Soldering Epoxy Dynamic mechanical analysis Glass transition Composite material Molding (decorative) Thermal stability Polymer Chemical engineering

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Synthesis and properties of polymers

Physical Sciences → Materials Science → Polymers and Plastics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Epoxy Resin Curing Processes

Physical Sciences → Engineering → Mechanical Engineering

Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature

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