JOURNAL ARTICLE

Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature

Hui‐Wang CuiDong‐Sheng LiQiong Fan

Year: 2012 Journal:   Journal of Electronic Materials Vol: 41 (9)Pages: 2599-2605   Publisher: Springer Science+Business Media
Keywords:
Materials science Soldering Epoxy Dynamic mechanical analysis Glass transition Composite material Molding (decorative) Thermal stability Polymer Chemical engineering

Metrics

6
Cited By
0.69
FWCI (Field Weighted Citation Impact)
13
Refs
0.67
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Synthesis and properties of polymers
Physical Sciences →  Materials Science →  Polymers and Plastics
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Epoxy Resin Curing Processes
Physical Sciences →  Engineering →  Mechanical Engineering
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