Process monitoring during AlN deposition by reactive magnetron sputtering

Juan Acosta; A. Rojo; O. Salas; J. Oseguera

doi:10.1016/j.surfcoat.2007.03.048

ScienceGate Book Chapters

JOURNAL ARTICLE

Process monitoring during AlN deposition by reactive magnetron sputtering

Juan Acosta A. Rojo O. Salas J. Oseguera

Year: 2007 Journal: Surface and Coatings Technology Vol: 201 (18)Pages: 7992-7999 Publisher: Elsevier BV

DOI: 10.1016/j.surfcoat.2007.03.048

Get Full-Text PDF Get Analytical Report

Keywords:

X-ray photoelectron spectroscopy Materials science Scanning electron microscope Analytical Chemistry (journal) Sputter deposition Cavity magnetron Deposition (geology) Sputtering Spectroscopy Energy-dispersive X-ray spectroscopy Thin film Chemical engineering Composite material Nanotechnology Chemistry Chromatography

Metrics

Cited By

3.36

FWCI (Field Weighted Citation Impact)

Refs

0.91

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

GaN-based semiconductor devices and materials

Physical Sciences → Physics and Astronomy → Condensed Matter Physics

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Process monitoring during AlN deposition by reactive magnetron sputtering

Metrics

Citation History

Topics

Related Documents

Process monitoring during AlNxOy deposition by reactive magnetron sputtering and correlation with the film's properties

Tutorial: Hysteresis during the reactive magnetron sputtering process

Reactive magnetron sputtering of TiN: Analysis of the deposition process

Note on the low deposition rate during reactive magnetron sputtering

Deposition of by reactive d.c. magnetron sputtering