JOURNAL ARTICLE

A Reworkable Epoxy Resin for Isotropically Conductive Adhesive

Yi LiC.P. Wong

Year: 2004 Journal:   IEEE Transactions on Advanced Packaging Vol: 27 (1)Pages: 165-172   Publisher: Institute of Electrical and Electronics Engineers

Abstract

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Keywords:
Epoxy Materials science Differential scanning calorimetry Glass transition Composite material Dynamic mechanical analysis Adhesive Curing (chemistry) Cyanate ester Thermosetting polymer Thermomechanical analysis Thermal expansion Polymer

Metrics

30
Cited By
7.57
FWCI (Field Weighted Citation Impact)
16
Refs
0.97
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Epoxy Resin Curing Processes
Physical Sciences →  Engineering →  Mechanical Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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