Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Chaosuan Kanchanomai; Yukio MIYASHITA; Yoshiharu MUTOH

doi:10.1007/s11664-002-0100-0

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Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Chaosuan Kanchanomai Yukio MIYASHITA Yoshiharu MUTOH

Year: 2002 Journal: Journal of Electronic Materials Vol: 31 (5)Pages: 456-465 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-002-0100-0

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Keywords:

Eutectic system Materials science Soldering Dendrite (mathematics) Ductility (Earth science) Metallurgy Fracture (geology) Microstructure Composite material Creep Geometry

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering

Aluminum Alloy Microstructure Properties

Physical Sciences → Engineering → Aerospace Engineering

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

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Citation History

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