Process of electroless plating Cu-Sn-Zn ternary alloy

Xinkuai He; Baizhen Chen; Geng-sheng Hu; Lingfeng Deng; Ningbo Zhou; Wen-zeng Tian

doi:10.1016/s1003-6326(06)60039-3

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Process of electroless plating Cu-Sn-Zn ternary alloy

Xinkuai He Baizhen Chen Geng-sheng Hu Lingfeng Deng Ningbo Zhou Wen-zeng Tian

Year: 2006 Journal: Transactions of Nonferrous Metals Society of China Vol: 16 (1)Pages: 223-228 Publisher: Elsevier BV

DOI: 10.1016/s1003-6326(06)60039-3

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Keywords:

Materials science Alloy Ternary operation Corrosion Layer (electronics) Metallurgy Microstructure Plating (geology) Brass Metal Chemical engineering Electrochemistry Morphology (biology) Copper Composite material Electrode Chemistry

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering

Process of electroless plating Cu-Sn-Zn ternary alloy

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