Slow crack growth in ceramic materials at elevated temperatures

A.G. Evans; L Russell; David W. Richerson

doi:10.1007/bf02672290

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JOURNAL ARTICLE

Slow crack growth in ceramic materials at elevated temperatures

A.G. Evans L Russell David W. Richerson

Year: 1975 Journal: Metallurgical Transactions A Vol: 6 (4)Pages: 707-716 Publisher: Springer Science+Business Media

DOI: 10.1007/bf02672290

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Keywords:

Materials science Silicon nitride Isothermal process Ceramic Paris' law Stress intensity factor Composite material Crack closure Stress (linguistics) Range (aeronautics) Nitride Fracture mechanics Silicon Forensic engineering Metallurgy Thermodynamics Engineering

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Topics

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

High-Velocity Impact and Material Behavior

Physical Sciences → Materials Science → Materials Chemistry

Aluminum Alloys Composites Properties

Physical Sciences → Engineering → Mechanical Engineering

Slow crack growth in ceramic materials at elevated temperatures

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