Ablative photodecomposition of polymer films by pulsed far‐ultraviolet (193 nm) laser radiation: Dependence of etch depth on experimental conditions

Abstract

Abstract Data on the ablative photodecomposition of three condensation polymers [polyimide, poly(ethylene terephthalate), and polycarbonate] and one addition polymer (polymethyl methacrylate) by laser pulses at 193 nm are presented. The etch depth/pulse is a linear function of the number of pulses at constant laser fluence. It varies with the logarithm of the fluence in a linear manner at different fluences. The etch depth is independent of the atmosphere above the film, whether it is air at 1 atm, or a vacuum. The etching of PMMA at fluences > 100 mJ/cm 2 is believed to follow a mechanism different from the process at lower fluences. Etching of polyimide and polyethylene terephthalate at 248 and 308 nm is also reported. The mechanism of etching by laser radiation may receive greater contribution from a thermal process with increasing wavelength. This is manifested in the etch depth versus log fluence plot by sharp changes in slope.