High Temperature Superconductor Thick Films on Alumina Substrates

Abstract

The objective of this study is to utilize the recently discovered superconductor at temperatures above 90{Kappa} and to develop an optimum thick film depositing technique for application to high-frequency electronic devices, hybrid circuits, sensors, and electromagnetic shielding. This requires an easy method of depositing films on substrate, a reasonable value of critical current density at liquid nitrogen temperature, and excellent adhesion to the substrates being used. The authors have chosen the polycrystalline Al/sub 2/O/sub 3/ as substrate material because it is relatively inexpensive and can be manufactured to various shapes very easily.