A Nano-Silver Inkjet Conductive Ink with Excellent Adhesion

Abstract

In this paper，the preparation of a solvent based nano-silver inkjet conductive ink with excellent adhesion was investigated and applied. Nano-silver particles, with dodecylamine (DDA) as the protective agent, were prepared and the effect of protective agent on the post heat-treatment of nano- silver films was investigated. Results of electrical resistance, micro-structural evolution and thermal analysis showed that the Ag/DDA films require a relatively low treatment temperature to convert into conductive materials. Then the conductive ink was prepared with well dispersed Ag/DDA nanoparticles and the ink was printed patterns on PET、PI films through EPSON ME 33 inkjet printer , the patterns showed a sheet resistance is 182.3mΩ/□ and the adhesion reached to 5B after heat-treating at 120°C for 60min .