Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips

Shutian Liu; Yongcun Zhang; Peng Liu

doi:10.1007/s00231-007-0240-0

ScienceGate Book Chapters

JOURNAL ARTICLE

Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips

Shutian Liu Yongcun Zhang Peng Liu

Year: 2007 Journal: Heat and Mass Transfer Vol: 44 (2)Pages: 221-227 Publisher: Springer Science+Business Media

DOI: 10.1007/s00231-007-0240-0

Get Full-Text PDF Get Analytical Report

Keywords:

Microchannel Heat sink Materials science Pressure drop Heat transfer Mechanics Fractal Electronics cooling Thermodynamics Drop (telecommunication) Mechanical engineering Physics Nanotechnology Mathematics

Metrics

Cited By

2.60

FWCI (Field Weighted Citation Impact)

Refs

0.88

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Heat Transfer and Optimization

Physical Sciences → Engineering → Mechanical Engineering

Heat Transfer Mechanisms

Physical Sciences → Engineering → Mechanical Engineering

Heat Transfer and Boiling Studies

Physical Sciences → Engineering → Mechanical Engineering

Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips

Metrics

Citation History

Topics

Related Documents

Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop

Heat Transfer and Pressure Drop of Nanofluids in a Microchannel Heat Sink

Heat transfer and pressure drop in a ZrB2 microchannel heat sink: A numerical approach

Conjugate heat transfer in fractal-shaped microchannel network heat sink for integrated microelectronic cooling application

Heat transfer and pressure drop in fractal tree-like microchannel nets