Laser-induced site-selective silver seeding on polyimide for electroless copper plating

Dongsheng Chen; Qinghua Lu; Yan Zhao

doi:10.1016/j.apsusc.2006.02.039

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JOURNAL ARTICLE

Laser-induced site-selective silver seeding on polyimide for electroless copper plating

Dongsheng Chen Qinghua Lu Yan Zhao

Year: 2006 Journal: Applied Surface Science Vol: 253 (3)Pages: 1573-1580 Publisher: Elsevier BV

DOI: 10.1016/j.apsusc.2006.02.039

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Keywords:

Polyimide Copper Materials science Metal Laser Copper plating Deposition (geology) Seeding Irradiation X-ray photoelectron spectroscopy Plating (geology) Metallurgy Chemical engineering Analytical Chemistry (journal) Composite material Optics Electroplating Chemistry Layer (electronics) Organic chemistry

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Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Molecular Junctions and Nanostructures

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Laser-induced site-selective silver seeding on polyimide for electroless copper plating

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