Grain boundary interdiffusion and stresses in thin polycrystalline films

Leonid Klinger; Eugen Rabkin

doi:10.1007/s10853-010-5237-2

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Grain boundary interdiffusion and stresses in thin polycrystalline films

Leonid Klinger Eugen Rabkin

Year: 2011 Journal: Journal of Materials Science Vol: 46 (12)Pages: 4343-4348 Publisher: Springer Science+Business Media

DOI: 10.1007/s10853-010-5237-2

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Keywords:

Materials science Grain boundary Ultimate tensile strength Solid mechanics Crystallite Composite material Stress (linguistics) Kinetics Stress relaxation Thin film Diffusion Relaxation (psychology) Inert Substrate (aquarium) Metallurgy Thermodynamics Creep Microstructure Nanotechnology

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Microstructure and mechanical properties

Physical Sciences → Materials Science → Materials Chemistry

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Grain boundary interdiffusion and stresses in thin polycrystalline films

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