High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

Jung‐Pyo Hong; Sungwon Yoon; Taeseon Hwang; Joon Suk Oh; Seung-Chul Hong; Youngkwan Lee; Jae‐Do Nam

doi:10.1016/j.tca.2012.03.002

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High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

Jung‐Pyo Hong Sungwon Yoon Taeseon Hwang Joon Suk Oh Seung-Chul Hong Youngkwan Lee Jae‐Do Nam

Year: 2012 Journal: Thermochimica Acta Vol: 537 Pages: 70-75 Publisher: Elsevier BV

DOI: 10.1016/j.tca.2012.03.002

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Keywords:

Materials science Thermal conductivity Boron nitride Composite material Epoxy Particle (ecology) Nitride Filler (materials) Particle size Conductivity Thermal conduction Thermal contact conductance Composite number Thermal resistance Thermal Chemical engineering Chemistry

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Thermal properties of materials

Physical Sciences → Materials Science → Materials Chemistry

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Tribology and Wear Analysis

Physical Sciences → Engineering → Mechanics of Materials

High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

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