JOURNAL ARTICLE

Dynamic mechanical analysis of ethylene–propylene–diene monomer rubber and styrene–butadiene rubber blends

T. Muraleedharan NairM. G. KumaranG. UnnikrishnanV. Bhoothalingam Pillai

Year: 2008 Journal:   Journal of Applied Polymer Science Vol: 112 (1)Pages: 72-81   Publisher: Wiley

Abstract

Abstract The effects of blend ratio, crosslinking systems, and fillers on the viscoelastic response of ethylene–propylene–diene monomer (EPDM)/styrene–butadiene rubber (SBR) blends were studied as functions of frequency, temperature, and cure systems. The storage modulus decreased with increasing SBR content. The loss modulus and loss tangent results showed that the EPDM/SBR blend vulcanizate containing 80 wt % EPDM had the highest compatibility. Among the different cure systems studied, the dicumyl peroxide cured blends exhibited the highest storage modulus. The reinforcing fillers were found to reduce the loss tangent peak height. The blend containing 40 wt % EPDM showed partial miscibility. The dispersed EPDM phase suppressed the glass‐transition temperature of the matrix phase. The dynamic mechanical response of rubbery region was dominated by SBR in the EPDM–SBR blend. The morphology of the blend was studied by means of scanning electron microscopy. The blend containing 80 wt % EPDM had small domains of SBR particles dispersed uniformly throughout the EPDM matrix, which helped to toughen the matrix and prevent crack propagation; this led to enhanced blend compatibility. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009

Keywords:
Materials science Dynamic mechanical analysis Composite material Natural rubber EPDM rubber Styrene-butadiene Ethylene propylene rubber Polymer blend Miscibility Dynamic modulus Glass transition Copolymer Polymer Styrene

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Citation History

Topics

Polymer Nanocomposites and Properties
Physical Sciences →  Materials Science →  Polymers and Plastics
Polymer crystallization and properties
Physical Sciences →  Materials Science →  Polymers and Plastics
Epoxy Resin Curing Processes
Physical Sciences →  Engineering →  Mechanical Engineering
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