JOURNAL ARTICLE
Semiconductor wafer bonding: recent developments
Year: 1994 Journal: Materials Chemistry and Physics Vol: 37 (2)Pages: 101-127 Publisher: Elsevier BV
Keywords:
Wafer bonding Wafer Semiconductor Materials science Anodic bonding Silicon on insulator Direct bonding Silicon Engineering physics Optoelectronics Interface (matter) Nanotechnology Insulator (electricity) Semiconductor device Composite material Layer (electronics) Engineering
Metrics
130
Cited By
5.78
FWCI (Field Weighted Citation Impact)
73
Refs
0.97
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Semiconductor materials and devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
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