Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Alex A. Volinsky; N. Tymiak; Michael D. Kriese; W.W. Gerberich; J.W. Hutchinson

doi:10.1557/proc-539-277

ScienceGate Book Chapters

JOURNAL ARTICLE

Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Alex A. Volinsky N. Tymiak Michael D. Kriese W.W. Gerberich J.W. Hutchinson

Year: 1998 Journal: MRS Proceedings Vol: 539 Publisher: Cambridge University Press

DOI: 10.1557/proc-539-277

Get Full-Text PDF Get Analytical Report

Keywords:

Materials science Adhesion Delamination (geology) Nanoindentation Composite material Thin film Copper Dissipation Context (archaeology) Wafer Nanotechnology Metallurgy Thermodynamics

Metrics

Cited By

4.55

FWCI (Field Weighted Citation Impact)

Refs

0.94

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Metrics

Citation History

Topics

Related Documents

Quantitative Measurement of Thin Film Adhesion Force

A Semi-Quantitative Method for Thin Film Adhesion Measurement

Measurement of thin film adhesion

Measurement of copper thin film adhesion by multi-stages peel test

Moisture Effects on Copper Thin Film Adhesion