Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

J. Zhang; X.M. Zhang; Yinghao Zhou; M. Naka; S. A. Atroshenko

doi:10.1016/j.msea.2007.08.099

ScienceGate Book Chapters

JOURNAL ARTICLE

Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

J. Zhang X.M. Zhang Yinghao Zhou M. Naka S. A. Atroshenko

Year: 2008 Journal: Materials Science and Engineering A Vol: 495 (1-2)Pages: 271-275 Publisher: Elsevier BV

DOI: 10.1016/j.msea.2007.08.099

Get Full-Text PDF Get Analytical Report

Keywords:

Brazing Microstructure Materials science Ceramic Alloy Tin Layer (electronics) Composite material Filler (materials) Transmission electron microscopy Grain size Metallurgy Nanotechnology

Metrics

Cited By

0.64

FWCI (Field Weighted Citation Impact)

Refs

0.65

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

Metrics

Citation History

Topics

Related Documents

Interfacial microstructure of the Si3N4/Si3N4 joint brazed with Cu–Pd–Ti filler alloy

Microstructure and reaction phases in Si3N4/Si3N4 joint brazed with Cu–Pd–Ti filler alloy

Formation of interfacial microstructure in brazing of Si3N4 with Ti-activated Ag-Cu filler alloys

Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag–Cu–Ti+SiCp composite filler

Interfacial microstructure of Si3N4/Si3N4 joint brazed using Au–Ni–V filler alloy