JOURNAL ARTICLE
Thermoelectric power of vacuum-evaporated tin films
Year: 1983 Journal: Thin Solid Films Vol: 99 (4)Pages: 371-378 Publisher: Elsevier BV
Keywords:
Tin Mean free path Thermoelectric effect Scattering Materials science Seebeck coefficient Vacuum evaporation Thin film Grain boundary Range (aeronautics) Crucible (geodemography) Atmospheric temperature range Metallurgy Condensed matter physics Analytical Chemistry (journal) Composite material Thermodynamics Optics Nanotechnology Chemistry Physics Microstructure
Metrics
4
Cited By
0.70
FWCI (Field Weighted Citation Impact)
22
Refs
0.60
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Topics
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
Semiconductor materials and interfaces
Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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