Automatic 3-D inspection of solder paste on surface mount printed circuit boards

James Mahon

doi:10.1016/0924-0136(91)90138-5

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Automatic 3-D inspection of solder paste on surface mount printed circuit boards

James Mahon

Year: 1991 Journal: Journal of Materials Processing Technology Vol: 26 (2)Pages: 245-256 Publisher: Elsevier BV

DOI: 10.1016/0924-0136(91)90138-5

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Keywords:

Printed circuit board Surface-mount technology Solder paste Mount Automated optical inspection Wave soldering Focus (optics) Soldering Volume (thermodynamics) 3d printed Dip soldering Engineering Engineering drawing Computer science Mechanical engineering Electrical engineering Materials science Manufacturing engineering Composite material

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Industrial Vision Systems and Defect Detection

Physical Sciences → Engineering → Industrial and Manufacturing Engineering

Optical measurement and interference techniques

Physical Sciences → Computer Science → Computer Vision and Pattern Recognition

Advanced Measurement and Metrology Techniques

Physical Sciences → Engineering → Mechanical Engineering

Automatic 3-D inspection of solder paste on surface mount printed circuit boards

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